CHING LEEN through the most advanced automated production equipment and an aggressive management team, we was devoted to research and upgrade of the SMT processing. We convinced that elevated the high-quality professional electronic products processing factory should be continuous improvement and innovation. SMT OEM. Continuity provided the excellent quality and the best service to customer.

The latest automated production equipment and excellent process capability.

We have the latest automated production equipment and excellent process capability, the production processing of experience has motherboard, notebook, IPC, module, aluminum sheet (LED) and so on.

Process NameSpecification
Substrate Dimension (Solder Paste)

Maximum Size: 457mm(L) * 356mm(W)

Minimum Size: 80mm(L) * 50mm(W)

Substrate Dimension (Dispensing)

Maximum Size: 330mm(L) * 250mm(W)

Minimum Size: 80mm(L) * 50mm(W)

Substrate Thickness

Maximum Thickness: 4.0mm

Minimum Thickness: 0.5mm (Smaller than 0.5mm is must use of carrier.)

Parts Size

0603 (in.0201) R/C

74 * 74mm parts

IC Lead Pitch

Mounting Capability: 0.40mm

Camera Capability: 0.28mm

BGA Ball Pitch

Mounting Capability: 0.40mm

Camera Capability: 0.30mm

Steel Sheet Size

Maximum Size: 736mm(L) * 736mm(W)

Minimum Size: 400mm(L) * 400mm(W)

Printing Press Precision

Precision ±0.025mm / 6 σ

Printing Press Capacity

Automatic Crocking (Dry Rub, Wet Rub, Vacuum Seals Installation)

Mount Precision

Chip Precision: ±0.05mm / 3 σ

IC Precision: ±0.03mm / 3 σ

Reflow

Can add N2 on production

Production Experience

Motherboard

Notebook

IPC

Aluminum Sheet (LED)

FPC

Module